Description

HP OMEN MAX 16T Ai Ultra 9-275HX 64GB 2TB NVME 16 WUXGA 165HZ RTX 5090 24GB WIN 11 HOME SHADOW BLACK

• • Processor (CPU): Intel® Core™ Ultra 9 275HX
    • • Cores / Threads: 24 Cores / 24 Threads
      • Clock Speed: Up to 5.4 GHz Max Turbo Frequency
      • Cache: 36 MB L3 Cache
      • AI Processing: Integrated Intel® AI Boost NPU (13 NPU TOPS) 

  • Graphics (GPU): NVIDIA® GeForce RTX™ 5090 Laptop GPU
    • • Video Memory: 24 GB GDDR7 Dedicated VRAM
      • TGP (Total Graphics Power): Peak performance up to 175W
      • Architecture Features: Blackwell architecture, DLSS 4/4.5, and Reflex 2

  • Memory (RAM): 64 GB DDR5-5600 MHz
    • • Configuration: Dual-channel layout (2 x 32 GB)
      • Expandability: 2 accessible SODIMM slots (upgradable up to 64GB) 

  • Storage: 2 TB PCIe® Gen4 NVMe™ Performance M.2 SSD

• • Size: 16.0-inch diagonal
  • Resolution: WUXGA (1920 x 1200)
  • Refresh Rate: 165 Hz
  • Panel Type: IPS, anti-glare, micro-edge border
  • Brightness: 400 nits
  • Eye Care: Low Blue Light certified 

• • Wireless: Intel® Wi-Fi 7 BE200 (2×2) or Wi-Fi 6E AX211, Bluetooth® 5.4 / 5
  • Left Side I/O:
    • • 2 x Thunderbolt™ 4 with USB Type-C® (40Gbps, USB Power Delivery, DisplayPort™ 2.1, HP Sleep and Charge)
      • 1 x 3.5mm Headphone/Microphone combo jack

  • Right/Rear I/O:
    • • 2 x USB Type-A 3.2 Gen 2 (10Gbps signaling rate, 1 supports Sleep and Charge)
      • 1 x HDMI 2.1
      • 1 x RJ-45 Ethernet port
      • 1 x AC Smart Pin power connector

• • Chassis Material & Color: Premium aluminum frame finished in Shadow Black
  • Keyboard: Full-size, per-key RGB backlit keyboard with numerical pad, integrated HyperX wireless receiver
  • Thermal Design: OMEN Tempest Cooling Pro system with metal liquid compound and dust-preventing self-cleaning fans
  • Audio: Dual speakers tuned by HyperX, DTS:X® Ultra support, HP Audio Boost
  • Battery: 6-cell, 83 Wh Li-ion polymer battery
  • Power Supply: 330W AC Power Adapter
  • Dimensions: 356.6 x 268.9 x 22.9–24.9 mm (14.04″ x 10.59″ x 0.90–0.98″)
  • Weight: ~2.69 kg – 2.72 kg (approx. 5.9 – 6.0 lbs)
• • Hybrid Formula: The OMEN Cryo Compound mixes liquid metal properties with standard paste materials to prevent the severe leaking and electrical short risks associated with pure liquid metal. 

  • Application: Applied directly to internal processors (CPU and GPU) under the cooling vapor chamber or heat sink in specialized configurations. [

  • Risks of Pure Liquid Metal: Standard pure liquid metal is electrically conductive and highly corrosive to aluminum. Unofficial or improper aftermarket applications can leak past foam barriers, leading to catastrophic motherboard shorts.

  1 year warranty